Single-Layer Drying Behavior of Red Chili

https://doi.org/10.22146/agritech.9580

Junaedi Muhidong(1*), Supratomo Supratomo(2), Nur Ftiri Ramadhani(3)

(1) Agricultural Engineering Department, Faculty of Agriculture, Hasanuddin University. Kampus Tamalanrea 90245, South Sulawesi, Indonesia
(2) Agricultural Engineering Department, Faculty of Agriculture, Hasanuddin University. Kampus Tamalanrea 90245, South Sulawesi, Indonesia
(3) Agricultural Engineering Department, Faculty of Agriculture, Hasanuddin University. Kampus Tamalanrea 90245, South Sulawesi, Indonesia
(*) Corresponding Author

Abstract


This study was designated to determine the best model that could represent the behavior of the moisture content of cut red-chili, Tombak variety, during the single layer drying process. A Tray Dryer Model EH-TD-300 Eunha Fluid Science was used to support the experiment. The dryer was constructed to flow the drying-air parallel with the crop observed. Three levels of drying air velocity (1.0 m/s, 1.5 m/s, and 2.0 m/s) were applied under a constant drying air temperature of 47oC. The average relative humidity (RH) in the drying chamber during the drying period was around 39%. The results of this study strongly suggested that the Hii et al. (2008) model, MR = 0.76832.exp(-0.06607.t1.43089) + 0.25351.exp(-0.06881.t1.43089) and MR = 0.76758.exp(-0.10141.t1.47651) + 0.30562.exp(-0.10018.t1.47651),  were the best model in predicting the moisture behavior of the cut chili, Tombak variety, across the elapsed drying time when the drying air velocities were set to 1.5 m/s and 2.0 m/s, respectively. However, the Diffusion Approach model, MR = -0.02821.exp(0.01340.t) + (1.02821)).exp(-0.107576.t), was observed to be the best model at the drying air velocity of 1.0 m/s.


Keywords


Single-layer drying; chili

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DOI: https://doi.org/10.22146/agritech.9580

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agriTECH (print ISSN 0216-0455; online ISSN 2527-3825) is published by Faculty of Agricultural Technology, Universitas Gadjah Mada in colaboration with Indonesian Association of Food Technologies.


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