The Breakdown Voltage Characteristics of Bamboo Insulation under Composite Layer Based

https://doi.org/10.22146/ijitee.36648

Lukmanul Hakim(1*), T. Haryono(2), Suharyanto Suharyanto(3)

(1) Universitas Gadjah Mada
(2) Universitas Gadjah Mada
(3) Universitas Gadjah Mada
(*) Corresponding Author

Abstract


Today, insulation system involves more than one insulation material, whether serial, parallel, or both. In insulation system, the simplest form is composite which consists of two layers of the same material. The benefit of using layered insulation is that the dielectric strength is higher than one layer with the same thickness. There are two methods to test bamboo isolator, i.e., tests of the breakdown voltage of bamboo wall and bamboo fiber. The tests used two methods of composite layers (acrylic and resin) and without composite layer (normal condition). The tests were intended to observe the breakdown voltage on each incidence in each test sample and discover the dielectric strength. The test result showed that the breakdown voltage of bamboo wall was bigger than bamboo fiber with or without composite layer. The highest dielectric strengths of acrylic layer in petung bamboo wall were 2.07 kV/mm and acrylic layer in bamboo fiber was 0.95 kV/mm in layered method. Meanwhile, in ampel bamboo wall it was 1.35 kV/mm and petung bamboo fiber it was 0.43 kV/mm in normal condition (without layer).

Keywords


insulation, bamboo, composite coating, breakdown voltage, dielectric strength

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References

Arismunandar, A., Teknik Tegangan Tinggi, Suplemen Pertama. Jakarta, Indonesia: Ghalia Indonesia, 1982.

D. Kind, An Introduction to High Voltage Experimental Techniques, New Delhi, India: Wiley Eastern Limited, 1978.

Hackam, R, “Outdoor High Voltage Polymeric Insulators,” Proceedings of 1998 International Symposium on Electrical Insulating Material, 1998, paper IM-1, pp. 1-16.

Berahim, H, “Pengaruh Silane sebagai Bahan Pengisi Material Isolasi Polimer Resin Epoksi di Daerah Tropis,” Media Tek., Vol. 28, No. 3, pp. 48-53, 2006.

Morisco, “Teknologi Bambu,” Universitas Gadjah Mada, Technical Report, 2005.

J. Ma, W. Chen, L. Zhao, and D. Zhao, “Elastic Buckling of Bionic Cylindrical Shells Based on Bamboo,” Journal of Bionic Eng., Vol. 5, No. 3, pp. 231-238, 2008.

A. Kadir, Transmisi Tenaga Listrik, Edisi Revisi. Jakarta: Universitas Indonesia, 1998.

B. L. Tobing, Dasar Teknik Tegangan Tinggi. Jakarta: PT. Gramedia Pustaka Utama, 2003.

M. Anas Wirawan and A. Purnomo, “Sifat Isolasi dan Proses Kegagalan Bahan Isolasi Padat,” Universitas Muhammadiyah Surakarta, Tech. Report, pp. 1-11, 2010.

J. F. D. Correal and C. J. Arbeldez, “Influence of Age and Height Position on Colombia Guadua Angustifolia Bamboo Mechanical Properties,” Maderas. Ciencia y Tecnología, Vol. 12, No. 2, pp. 105-113, 2010.

M. Riyadi and Amalia, "Teknologi Bahan", Politeknik Negeri Jakarta, Lecture Note, 2005.

F. R. Wijaya, “Pengaruh Pengawetan dengan Metode Perendaman dalam Larutan Prusi Terhadap Karakteristik Bambu Ampel (Bambusa vulgaris Schrad),” Thesis, Universitas Gadjah Mada, Indonesia, 2003.

Prasojo, A. Winarko, S. Abdul, and Yuningtyastuti, “Analisis Partial Discharge pada Material Polimer Resin Epoksi dengan Menggunakan Elektroda Jarum Bidang.” Thesis, Universitas Diponegoro, Indoensia, 2009.

Lee, Henry, and Kris Neville, Epoxy Resins Their Applications and Technology. London, UK: McGraw-Hill Book Company, Inc., 1957.



DOI: https://doi.org/10.22146/ijitee.36648

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